| 摘要 |
The semiconductor device consists of a chip (2) forming an integrated circuit, an electrical connection grid (12) with a central plate and a thermal dissipator (6). The passive face of the chip is fixed, preferably by adhesive, to a thrust face (10) of the dissipator and the central plate of the grid, which has an aperture giving it the form of a ring (13) extending round the chip. The branches (14) of the central grid ring are fixed, preferably by soldering, to the thrust face of the dissipator, at points distant from the corners of the grid. In addition, the thrust face has centering and fixing pegs (16) which engage with recesses (17) in the corners of the central grid ring. The pegs tend to pull the ring outwards along diagonal lines. |
