SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To prevent an adhesive agent or wax from being projected or from flowing out and being stuck on the surface of a semiconductor or dielectric in a vertical gap between a hole formed for packaging the semiconductor on the laminated dielectric and the semiconductor. SOLUTION: At least one dielectric 9 formed with a hole further larger than a hole formed for packaging a semiconductor 1 is laminated in the upper direction of a dielectric 20 positioned under the semiconductor 1. Further, the hole for packaging the semiconductor 1 is formed on dielectrics 7 and 8 laminated thereon so that the semiconductor package and a substrate structure can be configured.