METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE TAPE CARRIER

摘要

PROBLEM TO BE SOLVED: To easily covering/plating only a ball forming land by discriminating it from a bent hole and a positioning hole in the manufacturing method of a semiconductor device tape carrier. SOLUTION: A copper foil 4 is previously removed by etching so that the copper foil 4 does not remain in the regions of the bent hole 9 and a positioning hole 10 and wiring 8 is formed. Then, electrolytic plating is performed and a conductive metal layer 6 is formed on the ball forming lead exposed from an opening part by electroplating.