| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate and a multilayer printed wiring board which are superior in resistance to chemicals and toughness. SOLUTION: This laminate is provided with core material having an inner layer circuit and an insulating layer, which has a first layer constituted of base material and resin, and a second layer constituted of resin. In the laminate, it is preferable that the first layer and the second layer are laminated at least one time in the order of the core material having the inner layer circuit, the first layer and the second layer. This multilayer printed wiring board is constituted by bonding a metal foil to at least one surface of the laminate. |
