STRUCTURE FOR MOUNTING ELECTRONIC COMPONENT ON WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To make soldering secure without raising heating temperature nor increasing a heating time even when solder whose fusion point is raised for strength improvement is used. SOLUTION: The mounting structure 9 in which a connection part 12 provided to a wiring pattern 11 on a printed wiring board 10 and an electrode part 14 of an electronic component are connected through solder 15 has a heat reception part 17 formed by coating outside the part of the connection pad part 12 where the electrode part 14 is connected.