| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil for a printed circuit board in which an adhesive strength between the foil and a resin board is maintained highly even under severe conditions due to heat, chemical agent or the like at the time of laminating when a copper-clad laminate is formed and which has excellent migration resistance, which remarkably contributes to improvement in insulating characteristics of a printed circuit and which can be suitably used as copper foils for inner and outer layers of the board. SOLUTION: The copper foil for the printed circuit board comprises a carbon- containing copper-zinc film layer on at least one surface of the foil. In the copper foil, the migration resistance is 390 to 450.
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