| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor processing unit in which heat radiation to a semiconductor substrate is reduced by suppressing a temperature rise of a cover disposed in a chamber and reaction products adhering to the cover are removed easily. SOLUTION: Deposition of reaction products on the inner wall face of a chamber 1 is prevented by a cover 10. In order to reduce heat radiation from the cover 10 to a semiconductor substrate 9, semiconductor cooling elements 13 are arranged on the cover 10, and a current is fed in the direction for causing the endothermic reaction of the semiconductor cooling element 13 thus absorbing heat stored in the cover 10. The separation of the reaction products is facilitated by feeding a current in the direction for causing the exothermic reaction of the semiconductor cooling element 13 thereby elevating the temperature of the cover 10. |
