发明名称 FORMING METHOD FOR FINE HOLE IN PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To provide a forming method for a fine hole in a printed board which can form even the fine hole of any diameter, make its production speed fast, and achieve effects such as low cost, low contamination, etc. SOLUTION: By this forming method, the fine hole can be formed in the printed board speedily at a low cost by etching other materials (e.g. glass fibers) of the printed board 10 which can not be removed with plasma by using a chemical solution after etching for the fine hole is carried out by mainly using plasma technology and plasma etching is performed.
申请公布号 JP2003124602(A) 申请公布日期 2003.04.25
申请号 JP20010314177 申请日期 2001.10.11
申请人 KYOKUZO KOFUN YUGENKOSHI 发明人 SU KYOKA;SO JUGEN;RYU KOZON
分类号 H05K3/00;(IPC1-7):H05K3/00 主分类号 H05K3/00
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