发明名称 Stacked capacitor and method for fabricating the same
摘要 A stacked capacitor on a contact plug of a semiconductor substrate and the method for fabricating the same. A cylindrical conductive layer is formed upon a contact plug of a semiconductor substrate as a lower electrode of a stacked capacitor and there is an opening in the cylindrical conductive layer. A barrier layer is deposited inside the opening of the cylindrical conductive layer and fills a portion of the opening. A capacitor dielectric layer is deposited on the cylindrical conductive layer and on the barrier layer and an upper electrode layer is formed on the capacitor dielectric layer to complete the stacked capacitor.
申请公布号 US2003075753(A1) 申请公布日期 2003.04.24
申请号 US20020243554 申请日期 2002.09.13
申请人 CHU CHUNG-MING;KIYOTOSHI MASUHIRO;FUKUDA MASATOSHI;SUZUKI TOSIYA;YANG MIN-CHIEH 发明人 CHU CHUNG-MING;KIYOTOSHI MASUHIRO;FUKUDA MASATOSHI;SUZUKI TOSIYA;YANG MIN-CHIEH
分类号 H01L27/105;H01L21/02;H01L21/8242;H01L21/8246;H01L27/108;(IPC1-7):H01L21/824;H01L29/76;H01L29/94;H01L31/119;H01L21/20 主分类号 H01L27/105
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