MICROELECTRONIC SPRING WITH ADDITIONAL PROTRUDING MEMBER

摘要

Various structural features for modifying the performance characteristics of cantilevered microelectronic spring structures (102) are disclosed. Generally, the features comprise a protruding member (120) mounted between a supporting substrate (116) and the transverse cantilever beam (106) of a microelectronic spring structure (102), at a distance spaced apart from the supporting structure from which the beam is cantilevered. The protruding member (120) may be equal to the clearance under the beam, less than the clearance under the beam, or adjustable in height; and may be attached or mounted to either the beam or the substrate. The protruding member may be substantially rigid and incompressible, and shorter than the clearance under the beam or "soft" and compressible. The protruding member may comprise an electronic device attached to both the substrate and the beam. Additionally the protruding member may be comprised of an adjustable pressure device.