| 摘要 |
<p>A method for improving alignment of a transparent or semi-transparent workpiece (20) consisting of silicone wafer (30, 32) for integrated circuits undergoing multi-step processing during their manufacturing process, the method comprising: providing laser patterning system comprising an ultra-short pulsed laser source (10) for generating an ultra-short pulsed beam, optical elements for directing and focusing the beam at predetermined target locations within the workpiece (20), and control unit (24) for controlling the ultra-short pulsed laser source (10) and the optical elements, so as to produce a predetermined pattern inscribed within the workpiece (20); and inscribing a predetermined pattern within the workpiece (20).</p> |
