| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding method and a device for allowing highly accurate plane grinding for a thin disk-like or polygonal plate-like workpiece such as a wafer by reducing influence of elastic deformation and thermal deformation between a grinding wheel and the workpiece. SOLUTION: A horizontal shaft plane grinding machine is provided with a wheel spindle stock 9 for supporting a grinding wheel shaft, a workpiece holder 14 for supporting a workpiece shaft, and a cut-in mechanism 13 so that the shafts become horizontal. The grinding wheel shaft and the workpiece shaft are put in the mutually horizontal and parallel positional relationship, and when a radius of the workpiece 2 is set to Rw and a radius of the grinding wheel is set to Rs, the axis of the grinding wheel shaft is arranged by shifting by Rw/2=dy in the horizontal direction, and by Rs 1-(Rw/2Rs)<2> }<1/2> =dz in the vertical direction to the axis of the workpiece shaft, and the workpiece is ground by a work surface falling within a range of 2tan<-1> (dy/dz) in a central angle to the axis of the grinding wheel shaft.
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