REDUCING VOID FORMATION IN CURABLE ADHESIVE FORMULATIONS,申请号EP19970952684-传众专利搜索

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发明名称	REDUCING VOID FORMATION IN CURABLE ADHESIVE FORMULATIONS
摘要
申请公布号	EP0950082(B1)	申请公布日期	2003.04.23
申请号	EP19970952684	申请日期	1997.12.29
申请人	QUANTUM MATERIALS, INC.	发明人	FORRAY, DEBORAH, DERFELT
分类号	C08J3/24;B29C65/52;C09J5/00;C09J11/00;C09J201/00;H01L21/52;H05K3/30;H05K3/38;(IPC1-7):C09J5/02;H01L21/58	主分类号	C08J3/24
代理机构		代理人
主权项
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