发明名称 VALVE GATE TYPE MOLD ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To uniformly heat the molding compound in a material passage in a valve gate type mold assembly equipped with a valve sleeve. SOLUTION: The valve gate type mold assembly is equipped with a fixed mold 21 and a movable mold 22 both of which are mutually opened and closed to form a cavity 23 at mold clamping and an annular gate 73 for opening the material passage 42 provided to the fixed mold 21 to the cavity 23. A valve device 33 is equipped with a valve casing 34 having the material passage 42 therein, the cylindrical valve sleeve 71 for opening and closing the gate 73 and the center pin 72 coming into contact with the core pin 82 of the movable mold 22 at mold clamping. A ring heater 61 is provided in the vicinity of the gate 73 of the valve casing 34. Since the center pin 72 comes into contact with the movable mold 22 at mold clamping, heat is easy to escape to the movable mold 22 but the molding compound in the material passage 42 can be heated even on the side of the gate 73 by the heating of the ring heater 61.
申请公布号 JP2003117958(A) 申请公布日期 2003.04.23
申请号 JP20010311621 申请日期 2001.10.09
申请人 MITSUBISHI MATERIALS CORP 发明人 HIGUCHI YOSHINORI;HORIKAWA YOSHIHIRO
分类号 B29C45/28;B29C45/26;B29C45/73;(IPC1-7):B29C45/28 主分类号 B29C45/28
代理机构 代理人
主权项
地址