发明名称 HIGH-PRESSURE TREATMENT APPARATUS AND HIGH-PRESSURE TREATMENT METHOD
摘要 A processing fluid is not only supplied toward a surface side of a substrate (W) from supply nozzles (13, 13), but also flow directions (R1, R1) of the processing fluid supplied from the respective supply nozzles 13 deviate from each other within the surface of the substrate (W). Therefore, a whirling flow (TF) of the processing fluid is formed over the surface of the substrate (W) and the processing fluid comes into contact with the surface of the substrate (W), thereby performing a predetermined surface treatment (e.g. cleaning, first rinsing, second rinsing and drying).
申请公布号 KR20030032029(A) 申请公布日期 2003.04.23
申请号 KR20037003751 申请日期 2003.03.14
申请人 发明人
分类号 H01L21/027;B01J3/00;B01J3/02;B01J3/04;B08B3/02;B08B3/10;B08B5/02;C23G5/00;H01L21/00;H01L21/304 主分类号 H01L21/027
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