发明名称 |
Electronic device having electric wires and method of producing same |
摘要 |
An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag-Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing. |
申请公布号 |
US6552642(B1) |
申请公布日期 |
2003.04.22 |
申请号 |
US19990317665 |
申请日期 |
1999.05.24 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
TOI TAKAOMI;MORINAGA TETSUYA;BANDO MASAHIRO;HATAKENAKA TETSUO;KASAHARA KAZUO;SASAKI KOKI;HIROTSUJI TAKAYUKI |
分类号 |
B23K20/02;H01F17/04;H01F27/29;H01F41/10;(IPC1-7):H01F27/29 |
主分类号 |
B23K20/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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