| 摘要 |
PROBLEM TO BE SOLVED: To more uniformly improve the substrate processing rate of etching, plating, etc., applied onto a substrate surface, e.g. easily and quickly form a plating film of a more uniform thickness. SOLUTION: The processor has a substrate holder 10 for holding and spinning a substrate W, and a hot fluid feeder 24 for contacting a temperature-controlled hot fluid with the substrate W to control the temperature of the substrate W being held and spun by the substrate holder 10.
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