| 摘要 |
PROBLEM TO BE SOLVED: To make thin a semiconductor device and a laminated semiconductor device. SOLUTION: A semiconductor device 1 is equipped with a substrate 2 having electrodes 7 and 8 for connecting substrates that are formed on both the front and back and are connected by a through hole 9, a semiconductor chip 3 where an electrode that is connected to a wiring pattern formed on the substrate is provided and a surface opposite to a surface where the electrode is formed is cut flat, a bump 4 for connecting substrates that is provided on the electrode for connecting substrates of the substrates and has a surface that is opposite to the substrate and is cut flat, and resin 5 for sealing that is provided on the substrate seals the semiconductor chip and the bump for connecting substrates, and at the same time, has the surface that is opposite to the substrate and is cut flat. In this case, a cutting plane 3a of the semiconductor chip, a cutting plane 4a of the bump for connecting the substrates, and a cutting plane 5a of the resin for sealing are made to be positioned in the same plane, and the semiconductor chip and the bump for connecting substrates are sealed in the resin for sealing those other than the cutting plane. |
