| 摘要 |
PROBLEM TO BE SOLVED: To provide an attaching structure for a heat dissipation device projected from a back surface panel, capable of directly tightening the heat dissipation device to the back surface panel without opening a large hole on the back surface panel. SOLUTION: The back surface panel 1 is provided with a release 1a for heat generating components 5 attached to the heat dissipation device 2 and the heat dissipation device 2 is tightened to the back surface panel 1 so as to tightly adhere an attaching surface to the heat generating components 5 of the heat dissipation device 2 or a surface parallel to the surface to the back surface panel 1.
|
