发明名称 Heat sink/clip assembly for chip mounted on electronic card
摘要 A heat sink/clip assembly includes a clip (10) attaching a heat sink (30) to a chip (40) which is mounted on an electronic card (50). The clip includes a middle portion (11), two spring arms (14), and first and second legs (16, 18). First and second catches (17, 19) extend horizontally inwardly and toward each other from bottom ends of the first and second legs respectively. The first catch is longer than the second catch. The middle portion of the clip is accommodated in a channel (36) of the heat sink. A pair of notches (52) is defined in opposite side surfaces of the electronic card. The first catch is inserted into one of the notches. Then an opposite end of the clip is depressed, and the second catch is engaged in the other notch. Therefore the clip firmly attaches the heat sink to the chip.
申请公布号 US2003070790(A1) 申请公布日期 2003.04.17
申请号 US20010976970 申请日期 2001.10.11
申请人 CHEN RONG-CHE;KAO TIEN-LU;TAY CHOON-HWA 发明人 CHEN RONG-CHE;KAO TIEN-LU;TAY CHOON-HWA
分类号 H01L23/367;H01L23/40;(IPC1-7):F28F7/00;H05K7/20;H01L23/34 主分类号 H01L23/367
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