| 摘要 |
A method of, and apparatus for, mechanically masking a workpiece (30) to form exposure exclusion regions is disclosed. The apparatus includes a mask (70) that is arranged atop the photosensitive surface (32) of the workpiece (30). The mask (70) is opaque to the wavelength of radiation that activates the photosensitive workpiece surface (40). The mask (70) is placed onto the workpiece prior to lithographic exposure of the workpiece (30) so that the photosensitive material (e.g., negative acting photoresist) can be removed from the selected regions of the workpiece (30) to provide, for example, electrical contact directly to the workpiece upper surface.
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