Verfahren zum Schleifen von unbeschichteten Scheibenrückseiten

摘要

A silicon wafer grinding apparatus for grinding a backside surface of a semiconductor wafer that includes integrated circuit chips patterned on a frontside surface of the wafer. The apparatus includes a plurality of chuck tables that secure a plurality of wafers to be ground. Each chuck table includes a cushioned rubber pad secured to the table and an interface with the frontside surface of the wafer. An organic acid cooling fluid is utilized during the grinding procedure to prevent silicon particles and residue from being adhered to the metal bond pads of the integrated circuit chips.