| 发明名称 |
Interconnect structures and a method of electroless introduction of interconnect structures |
| 摘要 |
An apparatus including a substrate comprising a device having contact point; a dielectric layer overlying the device with an opening to the contact point; and an interconnect structure disposed in the opening including an interconnect material and a different conductive shunt material.
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| 申请公布号 |
US2003071355(A1) |
申请公布日期 |
2003.04.17 |
| 申请号 |
US20020290776 |
申请日期 |
2002.11.07 |
| 申请人 |
DUBIN VALERY M.;THOMAS CHRISTOPHER D.;MCGREGOR PAUL;DATTA MADHAV |
发明人 |
DUBIN VALERY M.;THOMAS CHRISTOPHER D.;MCGREGOR PAUL;DATTA MADHAV |
| 分类号 |
H01L21/288;H01L21/768;H01L23/532;(IPC1-7):H01L23/48;H01L29/40 |
主分类号 |
H01L21/288 |
| 代理机构 |
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| 主权项 |
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