| 摘要 |
A packaging and interconnection for connecting a contact structure to an outer component. The packaging and interconnection is formed of a contact structure mounted on a contact substrate, a contact trace formed on the contact substrate and electrically connected to the contact structure at one end and provided with a contact pad at another end, a print circuit board (PBS) pad provided on a PCB board substrate, a conductive lead for electrically connecting an upper surface of the contact pad and the connector, an elastomer provided under contact substrate, and a support structure provided between the contact structure, contact substrate and elastomer. The contact structure is projected from the contact substrate to a free space to allow free movements of at least a horizontal portion and a contact portion thereof. |
