发明名称 PATTERN FORMATION METHOD
摘要 PROBLEM TO BE SOLVED: To form a fine pattern shape in a work material precisely at a low cost by etching. SOLUTION: When a prescribed pattern is formed in a work material such as an interlaminar film 12 in manufacturing a semiconductor device, at first photoresist 13 is applied on the work material and subjected to exposure and development, and a resist film having a prescribed pattern is formed on the work material. Thereafter, the work material is etched to a predetermined depth by using a resist film as a mask. After the resist film is removed, the work material is further etched and the prescribed pattern is formed in the work material. In the process, an etching stopper film is formed in the predetermined depth. After etching is carried out until an etching stopper film is attained, photoresist is removed. A reflection preventive layer is used as an etching stopper film.
申请公布号 JP2003109943(A) 申请公布日期 2003.04.11
申请号 JP20010302557 申请日期 2001.09.28
申请人 MITSUBISHI ELECTRIC CORP;RYODEN SEMICONDUCTOR SYST ENG CORP 发明人 MIKI ICHIRO;MATSUNUMA KENJI;MAEDA SEIJI
分类号 G03F7/11;G03F7/40;H01L21/027;H01L21/302;H01L21/3065;H01L21/311;H01L21/3213;H01L21/768 主分类号 G03F7/11
代理机构 代理人
主权项
地址