| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-price non-contact electronic tag and a manufacturing method of it. SOLUTION: This electronic tag is provided with a lead 2 constituting an antenna, a slit 5 formed in a part of the lead 2 and extended at one end toward the outer edge of the lead 2, a semiconductor chip 3 mounted on the lead 2 in the vicinity of the slit 5, and a single Au wire 7, in which one end is bonded onto a bump electrode 6 in the semiconductor chip 3 while the other end is bonded onto the lead 2 in the area opposed to the semiconductor chip 3 mounting area while putting the slit 5 between them. The semiconductor chip 3 and the Au wire 7 are sealed with a resin, and the back face of the semiconductor chip 3 is electrically connected to the lead 2. |
