| 摘要 |
PROBLEM TO BE SOLVED: To provide the simple sealing structure of an electronic part excellent in a yield and capable of dissolving a trouble that the height and the outside dimension of a container get larger than specified values as a result of a surplus brazing filler for sealing leaking out from the upper surface of a wettable lid or the side of the lid during sealing. SOLUTION: In an electronic part that a cover and a container are sealed together by the brazing filler metal, a problem is settled by the sealing structure of the electronic part that Au plating is applied on the sealing surface of the container, one or more recessed parts are formed in at least each of the sides of the container, Au plated surface is formed on the sides of the recessed part, and the surplus brazing filler metal is collected to the Au plated parts of the sides of the recessed part or the sealing structure of the electronic part. A part where Au plating is absent on a seal surface is formed on the outer peripheral part of the plated part with plating thickness of 10-60μm, and a surplus brazing filler metal is collected to a non-plating part, away by 50-150μm from the outer peripheral edge of the container.
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