LEAD FRAME, SEMICONDUCTOR DEVICE AND METHOD FOR CONFIRMING MOUNTING POSITION OF SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To facilitate alignment at the time of mounting a semiconductor chip on a lead frame, and confirmation of the mounting position in the inspection process. SOLUTION: A concrete pattern having specified shape and area is provided on the die pad 5 of a lead frame 2 as a mark 1 for confirming the position of a semiconductor chip 3. When the semiconductor chip 3 is placed while deviating from an allowable mounting range 6 in the X direction, the semiconductor chip 3 covers the mark 1 and since the shape at the observable part (shaded part) of the mark 1 is varied, positional shift in the X direction can be recognized. Positional shift in the Y direction is judged by observing an electrode 4 located between the extensions of the side 8.