| 发明名称 |
METAL-CERAMICS CIRCUIT BOARD |
| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a metal-ceramics circuit board with which reliability in mounting components can be improved by overcoming problems when mounting components. SOLUTION: This metal-ceramics circuit board has a ceramic board 10 and a metallic circuit board (Cu board or Al board 14) bonded on this ceramic board 10 with a solder containing Ag or the like. The thickness of the metallic circuit board is made 0.1 to 0.5 mm, and the dimension difference (skirt amount) between the bottom and the top of the periphery of the metallic circuit board is made smaller than 50μm.</p> |
| 申请公布号 |
JP2003110205(A) |
申请公布日期 |
2003.04.11 |
| 申请号 |
JP20010304513 |
申请日期 |
2001.09.28 |
| 申请人 |
DOWA MINING CO LTD |
发明人 |
TSUKAGUCHI NOBUYOSHI;KIMURA MASAMI |
| 分类号 |
H05K1/02;H01L23/13;H01L23/373;H05K1/03;H05K3/06;H05K3/24;H05K3/38;(IPC1-7):H05K1/02 |
主分类号 |
H05K1/02 |
| 代理机构 |
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