| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate cleaning method and a device capable of efficiently removing deposits attached to a substrate in a short time, and to provide a substrate cleaning device. SOLUTION: A wafer W is installed inside a cleaning tank 2, and ozone is fed into the cleaning tank 2 by opening a valve 22. Then, while a flow control valve 8 is controlled, an air valve 9 and a valve 25 are kept open, a pump 7 is actuated to feed a cleaning solvent containing a carboxylic acid into the cleaning tank 2. Thereafter, an air valve 17 is opened to discharge the cleaning solvent from the cleaning tank 2 as a flow control valve 16 is controlled.
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