| 摘要 |
FIELD: mechanical fixation and electric contacts for semiconductor integrated circuits. SUBSTANCE: nonconducting substrate forming band or unit of use mounting plurality of bearing members, for instance those to be built in integrated-circuit card has its one side provided with conducting contact pads lying inside external mean camber line 4 dictating size of each bearing member and its other side is provided with conducting structures 9, 10, 11, 14, and 15 which form at least contact pads 11 inside each external mean camber line 14 for at least one coil of at least one integrated circuit to be brought in contact; depressions 13 are provided in substrate 2 beyond each external mean camber line 4 through which access is provided to coil leads of semiconductor integrated circuit on side of contact pads for testing as long as bearing member resides on band or in unit of use. EFFECT: disabling access to integrated circuit coil leads on side of contact pads upon separating bearing member from band or unit of use. 4 cl, 2 dwg
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