Polishing tool used for CMP

摘要

A polishing tool used for a CMP process is disclosed. The polishing tool includes a polishing platen for holding a wafer faced-up thereon and carrying the wafer to move to and fro between a first position and a second position, a polishing pad for polishing the wafer, and a holder for holding the polishing pad to self-rotate and carrying the polishing pad to move across the wafer surface and further driving the polishing pad to polish the wafer.