发明名称 Substrate processing apparatus for removing organic matter by removal liquid
摘要 An indexer part, removal processing part, interface, and dry processing part are disposed adjacent to each other in a row. That is, the removal processing part that performs removal processing of an organic matter by using a removal liquid is disposed adjacent to the indexer part loading and unloading a substrate with respect to the exterior of an apparatus. The interface that gives and receives a substrate between the removal processing part and dry processing part is interposed between the removal processing part and the dry processing part that performs dry processing of a substrate after passing through the removal processing. This enables to provide a substrate processing apparatus that can completely dry the substrate after a reaction product removal processing.
申请公布号 US2003066797(A1) 申请公布日期 2003.04.10
申请号 US20020256119 申请日期 2002.09.25
申请人 DAINIPPON SCREEN MFG. CO., LTD. 发明人 SASAKI TADASHI
分类号 H01L21/3065;B01D11/00;H01L21/00;H01L21/027;H01L21/304;H01L21/306;H01L21/677;H01L21/68;(IPC1-7):B01D11/00 主分类号 H01L21/3065
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