发明名称 |
Substrate processing apparatus for removing organic matter by removal liquid |
摘要 |
An indexer part, removal processing part, interface, and dry processing part are disposed adjacent to each other in a row. That is, the removal processing part that performs removal processing of an organic matter by using a removal liquid is disposed adjacent to the indexer part loading and unloading a substrate with respect to the exterior of an apparatus. The interface that gives and receives a substrate between the removal processing part and dry processing part is interposed between the removal processing part and the dry processing part that performs dry processing of a substrate after passing through the removal processing. This enables to provide a substrate processing apparatus that can completely dry the substrate after a reaction product removal processing.
|
申请公布号 |
US2003066797(A1) |
申请公布日期 |
2003.04.10 |
申请号 |
US20020256119 |
申请日期 |
2002.09.25 |
申请人 |
DAINIPPON SCREEN MFG. CO., LTD. |
发明人 |
SASAKI TADASHI |
分类号 |
H01L21/3065;B01D11/00;H01L21/00;H01L21/027;H01L21/304;H01L21/306;H01L21/677;H01L21/68;(IPC1-7):B01D11/00 |
主分类号 |
H01L21/3065 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|