发明名称 |
Nickel coated copper as electrodes for embedded passive devices |
摘要 |
The invention relates to the manufacture of metal foil electrodes useful in the manufacture of printed circuit boards having passive circuit components such as capacitors, resistors or inductors configured in a planar orientation. A copper foil is coated on each opposite side with a thin layer of nickel, which increases the range of functionality of the foil.
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申请公布号 |
US2003068517(A1) |
申请公布日期 |
2003.04.10 |
申请号 |
US20010971120 |
申请日期 |
2001.10.04 |
申请人 |
ANDRESAKIS JOHN A.;SKORUPSKI EDWARD;HERRICK WENDY;WOODRY MICHAEL D. |
发明人 |
ANDRESAKIS JOHN A.;SKORUPSKI EDWARD;HERRICK WENDY;WOODRY MICHAEL D. |
分类号 |
B32B15/01;C25D1/04;C25D5/16;C25D5/34;C25D7/06;C25D15/02;H01B5/02;H01C1/14;H01C7/00;H05K1/16;H05K3/38;(IPC1-7):B32B15/20 |
主分类号 |
B32B15/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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