发明名称 Nickel coated copper as electrodes for embedded passive devices
摘要 The invention relates to the manufacture of metal foil electrodes useful in the manufacture of printed circuit boards having passive circuit components such as capacitors, resistors or inductors configured in a planar orientation. A copper foil is coated on each opposite side with a thin layer of nickel, which increases the range of functionality of the foil.
申请公布号 US2003068517(A1) 申请公布日期 2003.04.10
申请号 US20010971120 申请日期 2001.10.04
申请人 ANDRESAKIS JOHN A.;SKORUPSKI EDWARD;HERRICK WENDY;WOODRY MICHAEL D. 发明人 ANDRESAKIS JOHN A.;SKORUPSKI EDWARD;HERRICK WENDY;WOODRY MICHAEL D.
分类号 B32B15/01;C25D1/04;C25D5/16;C25D5/34;C25D7/06;C25D15/02;H01B5/02;H01C1/14;H01C7/00;H05K1/16;H05K3/38;(IPC1-7):B32B15/20 主分类号 B32B15/01
代理机构 代理人
主权项
地址