发明名称 Substrate processing apparatus
摘要 The substrate processing apparatus has an enclosure structure enclosing a substrate support member to define a processing space. The enclosure structure has an opening closed by a shutter. A processing fluid supply unit, which supplies processing fluid, such as chemical liquid, is accommodated in a housing. The processing fluid supply unit accommodated in the housing is advanced into the processing space through the opening of the enclosure structure to feed the processing fluid onto the substrate supported by the substrate support member.
申请公布号 US2003010671(A1) 申请公布日期 2003.01.16
申请号 US20020195453 申请日期 2002.07.16
申请人 ORII TAKEHIKO;NISHIDA TATSUYA;KURODA OSAMU 发明人 ORII TAKEHIKO;NISHIDA TATSUYA;KURODA OSAMU
分类号 C03C23/00;H01L21/00;(IPC1-7):B65D85/00;B65D85/30 主分类号 C03C23/00
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