发明名称 |
Substrate processing apparatus |
摘要 |
The substrate processing apparatus has an enclosure structure enclosing a substrate support member to define a processing space. The enclosure structure has an opening closed by a shutter. A processing fluid supply unit, which supplies processing fluid, such as chemical liquid, is accommodated in a housing. The processing fluid supply unit accommodated in the housing is advanced into the processing space through the opening of the enclosure structure to feed the processing fluid onto the substrate supported by the substrate support member.
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申请公布号 |
US2003010671(A1) |
申请公布日期 |
2003.01.16 |
申请号 |
US20020195453 |
申请日期 |
2002.07.16 |
申请人 |
ORII TAKEHIKO;NISHIDA TATSUYA;KURODA OSAMU |
发明人 |
ORII TAKEHIKO;NISHIDA TATSUYA;KURODA OSAMU |
分类号 |
C03C23/00;H01L21/00;(IPC1-7):B65D85/00;B65D85/30 |
主分类号 |
C03C23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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