POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION

摘要

The invention provides a positive photosensitive resin composition which does not cause resist loss, swelling or peeling in development with an aqueous alkaline solution and can give dimensionally stable patterns through curing and the final cured membrane of which exhibit lowered water absorption and excellent alkali resistance. Specifically, a positive photosensitive polyimide resin composition, characterized by comprising a polyimide which comprises repeating units represented by the general formula (1) and is soluble in organic solvents, a polyamic acid comprising repeating units represented by the general formula (2), and a compound capable of generating an acid by irradiation with light: (1) (2) wherein m and n are each an integer of 3 to 10000; R1 and R3 are each a tetravalent organic group; and R2 and R4 are each a bivalent organic group, with the proviso that 5 to 100 % by mole of R2 is a fluorine−containing bivalent organic group.