PHENOL RESIN, EPOXY RESIN, THEIR PRODUCTION METHODS, AND COMPOSITION FOR SEMICONDUCTOR SEALING

摘要

PROBLEM TO BE SOLVED: To provide a phenol resin or an epoxy resin which is useful as a resin for semiconductor sealing and, when cured, gives a composition excellent in heat resistance. SOLUTION: This phenol resin is produced by reacting a phenol with an unsaturated cyclic hydrocarbon having at least two carbon - carbon double bonds in the presence of an acid catalyst, has an arithmetic mean mol.wt. (in terms of polystyrene) of 320 or lower, and contains not more than 2 mass% monofunctional component having at least one phenolic hydroxyl group in the molecule.