首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
AUTOMATIC REED CUTTING DEVICE
摘要
申请公布号
JPS53141993(A)
申请公布日期
1978.12.11
申请号
JP19770056435
申请日期
1977.05.18
申请人
TSUDAKOMA IND CO LTD
发明人
TAGAWA YASUNARI
分类号
B23C3/32;B23G1/32
主分类号
B23C3/32
代理机构
代理人
主权项
地址
您可能感兴趣的专利
SEMICONDUCTOR LASER BAR AND MANUFACTURE THEREOF
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
FORMATION OF LEAD OF HYBRID INTEGRATED CIRCUIT BOARD
CERAMIC LID SUBSTRATE FOR SEMICONDUCTOR PACKAGE
NONVOLATILE SEMICONDUCTOR MEMORY
MANUFACTURE OF SEMICONDUCTOR DEVICE
INTEGRATED CIRCUIT PROVIDED WITH TEMPERATURE SENSOR
SEMICONDUCTOR CHIP
MANUFACTURING METHOD OF TANTALUM CAPACITOR CHIP
LEAD STRUCTURE OF ELECTRONIC COMPONENT AND BONDING OF LEAD TO SUBSTRATE
HEAT-SENSITIVE RESIN MATERIAL, HEAT-SENSITIVE MATERIAL AND HEAT-SENSITIVE HEATING UNIT
CLEANING METHOD FOR SILICON WAFER
PRESS TOOL FOR CUTTING OF CONDUCTOR AND FOR TERMINATING OF ELECTRIC CONNECTOR
MICRO VACUUM TUBE
CIRCUIT BREAKER
DISC DRIVE
REMOTE CONTROLLER
HEAD POSITIONING APPARATUS AND RECORDING/REPRODUCING MEDIUM
OPTICAL INFORMATION PROCESSOR
MAGNETIC HEAD