发明名称 LEAD MEMBER FOR ELECTRONIC PART AND METHOD OF MANUFACTURING THIS LEAD MEMBER
摘要 PROBLEM TO BE SOLVED: To provide a lead member for electronic parts which is used as a terminal for external connection of the electronic parts used in various kinds of electronic apparatus, does not adversely affect the environment, solves the problem of poor wettability with solder and weldability and is capable of exhibiting excellent performance with simple plating constitution and a method of manufacturing the same. SOLUTION: The lead member for electronic parts which has only the advantages of both of dull plating and bright plating, does not give rise to the shortcomings of both and stably exhibits the good wettability with solder and weldability by successively laminating and forming a first plating layer 38 consisting of dull tin plating or leadless dull tin alloy plating containing at least one kind selected from the group of silver, copper and bismuth on the surface of a care material 32 and a second plating layer 40 consisting of the leadless bright tin alloy plating containing at least one kind selected from the group of the silver, copper and bismuth and adopting the constitution that the thickness of the second plating layer 40 ranges from >=1/12 to <=1/3 the total adding the thicknesses of the first plating layer 38 and the second plating layer 40.
申请公布号 JP2003105586(A) 申请公布日期 2003.04.09
申请号 JP20010297671 申请日期 2001.09.27
申请人 KYOWA DENSEN KK;FURUKAWA ELECTRIC CO LTD:THE 发明人 TAINAKA ICHIRO;SUGIE KINYA;TANAKA HITOSHI
分类号 C25D5/10;C25D7/00;(IPC1-7):C25D5/10 主分类号 C25D5/10
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