| 摘要 |
PROBLEM TO BE SOLVED: To provide a flame-retardant resin composition which exhibits good flame retardance and, simultaneously, excels in adhesion, soldering heat resistance, and lamination fabricability, and an adhesive sheet for semiconductor devices, a cover lay film, and a flexible printed circuit board. SOLUTION: The flame-retardant resin composition comprises (A) an epoxy resin having phosphorus in the molecule, and (B) a triazine modified phenol novolak resin. The adhesive sheet for semiconductor devices has an adhesive layer composed of the flame-retardant resin composition, and at least one layer of a releasable protective film layer. The cover lay film is constituted of a laminate of an insulating film coated with the above flame-retardant resin composition, and a releasable protective film layer. The flexible printed circuit board is obtained by adhering an insulating layer to a copper foil through an adhesive layer composed of the above flame-retardant resin composition.
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