METHOD FOR CORRECTING PATTERN POSITION DEVIATION AND DEFECT INSPECTING APPARATUS

摘要

PROBLEM TO BE SOLVED: To enable high-speed alignment at an adjacent comparison time between patterns of chips. SOLUTION: A displacement signal is formed by binarizing a reflecting light luminance signal from a sample surface to be inspected. A predetermined rectangular region in the displacement signal is made a first region. A lateral (X) direction of the rectangular region is made a first direction, and pixel values along the first direction are accumulated to obtain a first direction cumulative value. A second direction profile is formed by sequentially arranging the first direction cumulative values in a second direction. Position information of edges of a repeating pattern is detected on the basis of the formed second direction profile. A deviation width of how much adjacent chips deviate in the second direction is detected on the basis of the edge position information, and the deviation width is corrected. A longitudinal (Y) direction is made the first direction and the same process is carried out. A two-dimensional deviation width is corrected in this manner.