| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal head exhibiting excellent productivity and capable of reliable solder bonding to a driver IC or a flexible wiring board by forming an Ni plating layer of sufficient thickness on the circuit conductor of a head substrate. SOLUTION: The thermal head comprises a head substrate 1 having an upper surface fixed with a plurality of heating elements arranged linearly, a plurality of circuit conductors 6 principally comprising Al coated, at the opposite ends thereof, with a pair of Ni plating layers 8 and 9, and a driver IC having a plurality of input terminals being solder bonded to one Ni plating layer 8, and a flexible wiring board having a plurality of connecting parts being solder bonded to the other Ni plating layer 9, where a part in the vicinity of the other Ni plating layer 9 is coated with a substantially U-shaped auxiliary plating layer 10 on the upper surface of the head substrate and solder bonded to the connecting part of the flexible wiring board along with the other Ni plating layer 9.
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