发明名称 |
Electronic component-mounting substrate and electronic components |
摘要 |
<p>The invention provides an electronic component-mounting substrate wherein joint reliability of microstrip lines at the line of intersection between two signal line surfaces is enhanced, and also an increase in signal reflection and a decrease in transmission due to a line impedance mismatching can be prevented. The width of a line junction 22a of microstrip lines 22 formed on two signal line surfaces of a rectangular-solid dielectric 21 is provided to be broader than the width of a line end portion 22b. In addition, the width of the line junction 22a is designed such that the impedance would be equivalent to an impedance at a line end portion of the substituted lines if the microstrip lines 22 be equivalently substituted with lines on a substrate having a thickness equal to the length of a diagonal line of a cross section of the dielectric 21. <IMAGE></p> |
申请公布号 |
EP1300905(A2) |
申请公布日期 |
2003.04.09 |
申请号 |
EP20020256069 |
申请日期 |
2002.09.02 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
OOE, SATOSHI |
分类号 |
H01L23/12;H01L31/0232;H01P1/02;H01P5/02;H01S5/022;(IPC1-7):H01P1/02 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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