| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a high dielectric constant composite material excellent in dielectric performance, hardly causing a crack even when exposed to temperature histories, to prepare a high dielectric constant film, and to provide a laminate board with a metal foil and a print circuit board formed by using the composite material. SOLUTION: The high dielectric constant composite material comprises (A) a thermosetting resin such as an epoxy resin, (B) a phenoxy resin or a thermoplastic resin such as polyethersulfone or polyimide, (C) a dielectric filler as indispensable components, wherein the thermoplastic resin (B) is 10 to 50 mass% to the total resin solid content. The cured product of the composite material is excellent in dielectric performance and hardly causes crack even exposed to temperature histories. Also, the high dielectric constant film, the laminate board with the metal foil and the print circuit board formed by using the composite material, possess both toughness and adhesivity with metal foils. Preferably, the dielectric filler (C) is 30 to 90 mass% to the total solid content.</p> |
