WORK HOLDING BOARD AND POLISHING DEVICE AND POLISHING METHOD FOR WORK

摘要

PROBLEM TO BE SOLVED: To provide a polishing device and a polishing method, particularly a work holding board for polishing a wafer so that there are no irregular parts of a nanotopography level. SOLUTION: Microscopic pores are formed in a work holding face of the work holding board having a work holding board body for holding one principal plane of a work and polishing another principal plane into a mirror finish.