Socket for BGA package

摘要

The present invention relates to a BGA package IC socket that accommodates a BGA (ball grid array) package such that the BGA package IC socket has high reliability and can withstand long-term use. The socket is equipped with package receiving members 140. Package receiving parts 141 of members 140 receive the portions of the BGA package 10 located in the vicinity of the opposite edges of the undersurface of the BGA package 10. The parts 141 pivot downward with the insertion of the BGA package 10. The parts 141 have a shaft which are supported on the housing so that the package receiving members 140 are free to pivot. Springs 150 cooperate with the members 140, such that the springs 150 resist the insertion of the BGA package into the socket.