| 发明名称 |
Microelectronic joining processes with temporary securement |
| 摘要 |
A method of making microelectronic assemblies includes temporarily securing one or more microelectronic elements in place on one or more components using one or more temporary securements extending between the microelectronic elements and components and adhering to the elements and components. Conductive features of the elements are connected to conductive features of the components and the temporary securements are released.
|
| 申请公布号 |
US6543131(B1) |
申请公布日期 |
2003.04.08 |
| 申请号 |
US20000523514 |
申请日期 |
2000.03.10 |
| 申请人 |
TESSERA, INC. |
发明人 |
BEROZ MASUD;HABA BELGACEM |
| 分类号 |
H01L21/283;H01L21/288;H01L21/56;H01L21/60;H01L21/603;H01L21/68;H01L23/31;H01L23/48;(IPC1-7):H01R43/00;H05K13/00 |
主分类号 |
H01L21/283 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
