发明名称 Printed wiring board interposer sub-assembly
摘要 The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
申请公布号 US6545226(B2) 申请公布日期 2003.04.08
申请号 US20010871556 申请日期 2001.05.31
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BRODSKY WILLIAM LOUIS;CHAN BENSON;GAYNES MICHAEL ANTHONY;MARKOVICH VOYA RISTA
分类号 H05K3/32;(IPC1-7):H05K1/11;H05K1/16 主分类号 H05K3/32
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