发明名称 |
Semiconductor leadframes plated with lead-free solder and minimum palladium |
摘要 |
A leadframe for use with integrated circuit chips comprising a base metal having a plated layer of nickel fully covering said base metal; a plated layer of lead-free solder on said nickel layer, selectively covering areas of said leadframe intended for attachment to other parts; and a plated layer of palladium on said nickel layer, selectively covering areas of said leadframe intended for bonding wire attachment.
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申请公布号 |
US6545344(B2) |
申请公布日期 |
2003.04.08 |
申请号 |
US20010887857 |
申请日期 |
2001.06.22 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
ABBOTT DONALD C. |
分类号 |
H01L23/495;H05K3/34;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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