MULTI CHIP PACKAGE HAVING SPACER INSERTED BETWEEN CHIPS AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A multi chip package having a spacer inserted between chips is provided to embody a small multi chip package by stacking semiconductor chips of the same size or similar size while inserting the spacer. CONSTITUTION: A substrate(21) having a chip mounting region is prepared. A surface of the first chip opposite to an active surface having a chip pad is attached to the chip mounting region of the substrate. A spacer(31) is so attached to cross the active surface of the first chip, having such a thickness to guarantee a wire bonding space of the first chip and the substrate. A surface of the second chip opposite to an active surface having a chip pad is attached to the upper surface of the spacer. A conductive metal wire(41) electrically connects the fist and second chips with the substrate. A package body encapsulates the first chip, the second chip and the conductive metal wire, exposing both end surfaces of the spacer. An outer connection terminal is attached to a surface opposite to a chip mounting surface of the substrate.